The Engineering of Microelectronic Thin and Thick Films by C. E. Jowett (auth.)

By C. E. Jowett (auth.)

Show description

Read Online or Download The Engineering of Microelectronic Thin and Thick Films PDF

Similar engineering books

Circuit Design: Know It All (Newnes Know It All)

The Newnes realize it All sequence takes the simplest of what our authors have written to create hard-working table references that may be an engineer's first port of demand key info, layout options and principles of thumb. assured to not assemble dirt on a shelf!

Contents:
Chapter 1 The Fundamentals
Chapter 2 The Semiconductor diode
Chapter three realizing diodes and their problems
Chapter four Bipolar transistors
Chapter five box impression transistors
Chapter 6 picking out and warding off transistor problems
Chapter 7 Fundamentals
Chapter eight quantity Systems
Chapter nine Binary information Manipulation
Chapter 10 Combinational common sense Design
Chapter eleven Sequential good judgment Design
Chapter 12 Memory
Chapter thirteen deciding on a layout route
Chapter 14 Designing with common sense ICs
Chapter 15 Interfacing
Chapter sixteen DSP and electronic filters
Chapter 17 facing excessive velocity logic
Chapter 18 Bridging the distance among Analog and Digital
Chapter 19 Op Amps
Chapter 20 Converters-Analog Meets Digital
Chapter 21 Sensors
Chapter 22 energetic filters
Chapter 23 Radio-Frequency (RF) Circuits
Chapter 24 sign Sources
Chapter 25 EDA layout instruments for Analog and RF
Chapter 26 important Circuits
Chapter 27 Programmable common sense to ASICs
Chapter 28 advanced Programmable good judgment units (CPLDs)
Chapter 29 box Programmable Gate Arrays (FPGAs)
Chapter 30 layout Automation and trying out for FPGAs
Chapter 31 Integrating processors onto FPGAs
Chapter 32 enforcing electronic filters in VHDL
Chapter 33 Overview
Chapter 34 Microcontroller Toolbox
Chapter 35 Overview
Chapter 36 Specifications
Chapter 37 Off the shelf as opposed to roll your own
Chapter 38 enter and output parameters
Chapter 39 Batteries
Chapter forty structure and Grounding for Analog and electronic Circuits
Chapter forty-one Safety
Chapter forty two layout for Production
Chapter forty three Testability
Chapter forty four Reliability
Chapter forty five Thermal Management
Appendix A criteria

. A 360-degree view from our best-selling authors
. scorching subject matters covered
. the last word hard-working table reference; all of the crucial info, innovations and tips of the alternate in a single quantity

Engineering Mechanics: Dynamics (7th Edition)

The most recent version of Engineering Mechanics-Dynamics maintains to supply an identical prime quality fabric obvious in earlier variants. It offers widely rewritten, up-to-date prose for content material readability, marvelous new difficulties in new software components, amazing guideline on drawing unfastened physique diagrams, and new digital vitamins to aid studying and guide.

Microelectronic Circuit Design (5th Edition)

Richard Jaeger and Travis Blalock current a balanced assurance of analog and electronic circuits; scholars will advance a entire knowing of the elemental thoughts of recent digital circuit layout, analog and electronic, discrete and integrated.

A huge spectrum of themes are incorporated in Microelectronic Circuit layout which provides the professor the choice to simply opt for and customise the fabric to meet a two-semester or three-quarter series in electronics. Jaeger/Blalock emphasizes layout by utilizing layout examples and layout notes. very good pedagogical components comprise bankruptcy starting vignettes, bankruptcy ambitions, “Electronics in Action” packing containers, a problem-solving technique, and "Design Note” boxes.

The use of the well-defined problem-solving method awarded during this textual content can considerably increase an engineer’s skill to appreciate the problems on the topic of layout. The layout examples help in development and knowing the layout strategy.

Additional resources for The Engineering of Microelectronic Thin and Thick Films

Sample text

The second approach is conversion of pre-existing coatings or surface layers on the substrate by exposure to chemical reagents and/or energy. The selection of a preferred film-forming method is complex, involving, inter alia, substrate size, shape and throughput, film properties and tolerance and, if required, the film-patterning methods available. Two aspects of film structure influence film properties. On the atomic scale of dimensions the arrangement of the constituent atoms of the film relative to one another is predominant.

The technology produces resistive networks with reasonable tolerances without adjustment, or networks for application in A-D and D-A conversion, voltage division and instrumentation by precision resistance adjustment. Stability, TCR, TCR tracking and reliability of interconnections are inherent in either case. W to 1 W per resistor can be accommodated with good stability by proper choice of design, configuration, substrate material and packaging techniques. The minute linewidth resolution produced within the thin films offers significant reductions in size and weight.

Layers from a few micrometres average thickness to a few ten-thousandths of a metre are commonly employed. 0254 mm, the film is conventionally described as thick. Anything much below this is called a thin film. Of more direct interest to users are classifications based on purpose and, if possible, cost/effectiveness. Unfortunately, the latter feature is not expressible in general terms. 2. The functional or primary classification covers applications where the operation of the device takes place wholly or partially within a film material of suitable composition or shape.

Download PDF sample

Rated 4.28 of 5 – based on 9 votes