The Engineering of Microelectronic Thin and Thick Films by C. E. Jowett (auth.)

By C. E. Jowett (auth.)

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The second approach is conversion of pre-existing coatings or surface layers on the substrate by exposure to chemical reagents and/or energy. The selection of a preferred film-forming method is complex, involving, inter alia, substrate size, shape and throughput, film properties and tolerance and, if required, the film-patterning methods available. Two aspects of film structure influence film properties. On the atomic scale of dimensions the arrangement of the constituent atoms of the film relative to one another is predominant.

The technology produces resistive networks with reasonable tolerances without adjustment, or networks for application in A-D and D-A conversion, voltage division and instrumentation by precision resistance adjustment. Stability, TCR, TCR tracking and reliability of interconnections are inherent in either case. W to 1 W per resistor can be accommodated with good stability by proper choice of design, configuration, substrate material and packaging techniques. The minute linewidth resolution produced within the thin films offers significant reductions in size and weight.

Layers from a few micrometres average thickness to a few ten-thousandths of a metre are commonly employed. 0254 mm, the film is conventionally described as thick. Anything much below this is called a thin film. Of more direct interest to users are classifications based on purpose and, if possible, cost/effectiveness. Unfortunately, the latter feature is not expressible in general terms. 2. The functional or primary classification covers applications where the operation of the device takes place wholly or partially within a film material of suitable composition or shape.

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