Transactions on Engineering Technologies: Special Volume of by Gi-Chul Yang, Sio-long Ao, Len Gelman

By Gi-Chul Yang, Sio-long Ao, Len Gelman

This ebook includes revised and prolonged study articles written through fashionable researchers partaking within the overseas convention on Advances in Engineering applied sciences and actual technological know-how (London, U.K., 3-5 July, 2013). subject matters lined contain mechanical engineering, bioengineering, net engineering, snapshot engineering, instant networks, wisdom engineering, production engineering, and commercial functions. The publication bargains country of paintings of large advances in engineering applied sciences and actual technological know-how and purposes, and likewise serves as an exceptional reference paintings for researchers and graduate scholars operating with/on engineering applied sciences and actual science.

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Extra resources for Transactions on Engineering Technologies: Special Volume of the World Congress on Engineering 2013

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Yang et al. , Taiwan, ROC (Contract No. 100-EC-17-A-05-S1-189). References 1. R. A. N. Po, Error compensation in machine tools—a review. Part II: thermal error. Int. J. Mach. Tools Manuf. 40, 1257–1284 (2000) 2. S. K. W. Cho, Thermal error analysis for a CNC lathe feed drive system. Int. J. Mach. Tools Manuf. 39, 1087–1101 (1999) 3. J. Bryan, International status of thermal error research. Ann. CIRP. 39(2), 645–656 (1990) 4. R. A. N. Po, Thermal error measurement and modeling in machine tools. Part I.

Given the assumption of a linear elastic response, the stress-strain relationship is given by ~ r ¼ D~ e, where D has the form 1 0 k þ 2G k k 0 0 0 B k k þ 2G k 0 0 0C C B B k k k þ 2G 0 0 0 C C ð9Þ D¼B B 0 0 0 G 0 0C C B @ 0 0 0 0 G 0A 0 0 0 0 0 G k¼ vE ; ð1 þ vÞð1 À 2vÞ eth ¼ DTð a; a; G¼ E 2ð1 þ vÞ a; 0; 0; 0; ÞT ð10Þ ð11Þ D is the elasticity matrix consisting of the material properties, whereas the properties of E, m and a are the Young’s modulus, the Poisson’s ratio and the coefficient of thermal expansion (CTE).

Therefore, the number of smaller grains continues to shrink, while the larger grains continue to grow. Without the application of adequate thermal or mechanical energy grain growth is very slow. The rate of grain growth increases with the application of thermal energy, because increased diffusion allows for more rapid movement of molecules. The reduced number of grain boundaries (due to grain coarsening) allows dislocations (crystal defects) to move easily through the boundaries. This results in the solder joints to deform at much lower shear loads.

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